Dry and Wet Etching for Group III – Nitrides

Wet and Dry Etching Theory

Deep Wet and Dry Etching of Pyrex Glass: a Review

This paper is a review of wet and dry etching of one of the most common types of glass: Pyrex. The paper analyzes the methods for increasing the glass etch rate in HF solutions, namely, annealing, concentration, ultrasonic agitation and temperature. The limitations of the wet etching of glass are also presented. Mashing layers commonly used for deep wet etching of glass are analyzed, in terms o...

Patterning PDMS using a combination of wet and dry etching

PDMS films of 10 μm thickness can be patterned within 30 min by combining dry etching to achieve substantially vertical sidewalls with wet etching to achieve high etch rates and to protect the underlying substrate from attack. Dry etching alone would have taken 5 h, and wet etching alone would produce severe undercutting. In addition, using either technique alone produces undesirable surface mo...

Chemical bonding in group III nitrides.

We analyze in this article the evolution of the chemical bonding in group III nitrides (MN, M = Al, Ga, In), from the N-N bond dominated small clusters to the M-N bond dominated crystals, with the aim of explaining how the strong multiple bond of N(2) is destabilized with the increase in coordination. The picture that emerges is that of a partially ionic bond in the solid state, which is also p...

Method and apparatus for producing group-III nitrides